Advanced Packaging

Applied Materials

Opportunities in Through-Silicon Via Technology for 3D Packaging

The industry has reached a crucial inflection point on the adoption and commercialization of 3D packaging technology, and Applied Materials’ CTO Hans Stork gave attendees of the 3D Architectures for Semiconductor Integration and Packaging conference held recently in Burlingame, Calif. his assessment on the current status of this emerging technology.According to Stork, though significant challenges remain with vertical interconnects using through-silicon vias (TSVs), the semiconductor industry is on the verge of turning this into a manufacturing technology.