One of the biggest developments taking place in the semiconductor industry is the emergence of 3D NAND memory technology. Products are available today that feature 3D NAND devices. It has taken years to become a reality — since Toshiba first discussed the concept of 3D NAND at the VLSI Symposium in 2007 – and now it is poised to replace planar NAND flash memory for storage.
The path that has led to this point is similar to what happened with the logic roadmap; despite innovative workarounds, the era of traditional planar "shrinks" for NAND is running out of steam. And, just as with logic, it has required significant technical advances to overcome the formidable challenges to successfully manufacture complex vertical 3D NAND designs.