Personal mobile devices like smartphones, tablets and laptop PCs are rapidly evolving, becoming faster, smaller and functionally more sophisticated. To maintain this dramatic progress in device capability, the semiconductor industry is now at a new inflection point – the era of 3D chip packaging.
In this video, Applied’s Sesh Ramaswami discusses the fundamentals of advanced packaging and the revolutionary impact this technology is having on the gadgets we buy and the cloud infrastructure that makes mobility work.
3D Interconnect applications are attracting more and more interest from a large number of players in the semiconductor industry. I recently participated in two conferences (IWLPC – International Wafer Level Packaging Conference and IMAPS- International Microelectronics and Packaging Society Conference) on this topic to keep up-to-date on the new activities and developments in the industry and to share our latest advancements achieved with EMC3D consortium.