Automation Helps Overcome Productivity Challenges in Wafer-Level Packaging

Dec162016

Demand for higher functionality, thinner form factors and longer battery life in mobile devices is driving wafer-level packaging (WLP) to reduce power consumption and increase system-in-package performance. This advanced approach to packaging where processing is performed at the wafer level is significantly more complex to manufacture than traditional die-level packaging. It involves sophisticated and diverse chip-making fabrication processes. For many outsourced assembly and test (OSAT) suppliers, the transition to WLP is highly challenging as they adopt innovative packaging technologies and deploy fab-like advanced control processes and wafer fab equipment into their manufacturing environments.
 
Fab automation technologies can help enable this transition for OSATs. In this brief video, I describe how using innovative software automation strategies increases manufacturing flexibility, efficiency and quality to meet customer productivity requirements for their complex packaging designs.
 
 
This is part of a video series focusing on Applied’s SmartFactory® Automation Software, a comprehensive control and productivity suite in manufacturing. Additional details on how to overcome productivity challenges of WLP are provided in this article published in Applied’s Nanochip Fab Solutions magazine.