Applied Materials Hosts Memory Panel Discussion at IEEE IMW

New types of Storage Class Memory (SCM) are emerging that may offer faster performance and better endurance than NAND. While the new SCM technology can offer read performance approaching that of DRAM and much faster write performance than NAND, it poses new materials and process execution challenges as well as unresolved questions related to system design and memory management. Can the new SCM replace embedded applications? Will it become a commodity-type memory? Can it be cost-competitive with DRAM or NAND? What applications might be best suited for SCM?

These questions and more will be addressed during a panel discussion titled SCM: Technical and Commercial Challenges chaired by Applied Materials as part of the eighth IEEE International Memory Workshop (IMW) at the Paris Marriott Rive Gauche Hotel on May 16. We are delighted that distinguished speakers from several memory technology leaders including Intel, Samsung, SK hynix and Western Digital will participate to exchange opinions in what we anticipate will be a highly informative discussion moderated by Amulya Athayde, Global Product Management, Etch Products, Applied Materials. 

This IEEE conference is a leading forum for discussions among members of the international memory community on memory processes and design technologies, applications, market needs and strategies, and is well attended by our customers in both memory and logic.

Hope to see you there!

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