Join Applied Materials at the 2019 SPIE Advanced Lithography Symposium as we present our latest R&D advancements on layer-to-layer alignment, defect detection and 3D pattern characterization, and highlight new e-beam technology.
Applied Materials is a member of the new IBM Research AI Hardware Center—a new ecosystem of research and commercial partners collaborating with IBM to further accelerate the development of AI-optimized hardware innovations.
Applied Materials convened a panel of industry experts to explore trends and challenges for memory technology over the next decade—from continued scaling of mainstream technologies to developing new memory and computing architectures for Big Data and Artificial Intelligence.
As we wrap up 2016, it is an ideal time to reflect on the accomplishments of Applied teams around the world who have demonstrated a commitment to the company’s core value of operating with responsibility and integrity.
While the mainstay applications of the MEMS segment continue to be strong performers, 2016 saw a big push toward lots of new and potentially high-volume MEMS devices. This presents many exciting opportunities, but the challenges are plenty.
Innovations in software automation increase manufacturing flexibility, efficiency and quality to meet customer requirements for complex packaging designs.
