Applied’s newest Integrated Materials Solution solves the challenge of selective tungsten deposition, enabling simultaneous improvements in chip power, performance and area/cost (PPAC) in the most advanced foundry-logic nodes.
With EUV-enabled advances in 2D scaling pushing the limits of conventional materials engineering techniques, a breakthrough is needed to overcome increases in contact resistance and enable continued improvements in chip performance, power and area/cost (PPAC).
The senior vice president of Applied Materials’ Semiconductor Products Group provides his views on changes taking shape in the semiconductor industry as a new era of computing emerges centered on artificial intelligence (AI).
Cinequest’s 2018 Film & VR Festival celebrates and encourages artistic and technological innovations in entertainment. Learn more about this year’s festival and why the Applied Materials Foundation is excited to support it—and other groundbreaking arts and culture programs worldwide.
There is no place like CES to see the most exciting new and future displays. Beyond traditional technologies like television, displays also featured prominently in many of the big trends at the show: AI, automotive, VR, IoT and connectivity.