Improving logic device power and performance as critical dimensions scale requires materials innovation at the lower level interconnects—and Integrated Materials Solutions can accelerate customer success.
As we head into the holidays and count down the final days to a new year, we enter a fun and rewarding season of giving at Applied Materials where employees connect with community issues and come together to help those in need.
The ability to detect and identify defects becomes increasingly difficult as chips continue to shrink. In this blog, I discuss a new approach to Defect Review Scanning Electron Microscopy that increases sensitivity of defect identification and isolates true defects from the noise.
I recently sat down for a video interview with G. Dan Hutcheson, CEO of VLSIresearch, to discuss why the industry is moving to new memory solutions and what strategies are being implemented to alleviate the memory bottleneck.
As the semiconductor industry begins producing logic devices for the single digit nodes, new conductors are being evaluated as replacements for copper to manage resistance scaling. Applied Materials’ Mehul Naik highlights one of the leading contenders.