Applied’s newest Integrated Materials Solution solves the challenge of selective tungsten deposition, enabling simultaneous improvements in chip power, performance and area/cost (PPAC) in the most advanced foundry-logic nodes.
With EUV-enabled advances in 2D scaling pushing the limits of conventional materials engineering techniques, a breakthrough is needed to overcome increases in contact resistance and enable continued improvements in chip performance, power and area/cost (PPAC).
Join Applied Materials at the 2019 SPIE Advanced Lithography Symposium as we present our latest R&D advancements on layer-to-layer alignment, defect detection and 3D pattern characterization, and highlight new e-beam technology.
Applied Materials is a member of the new IBM Research AI Hardware Center—a new ecosystem of research and commercial partners collaborating with IBM to further accelerate the development of AI-optimized hardware innovations.
Applied Materials convened a panel of industry experts to explore trends and challenges for memory technology over the next decade—from continued scaling of mainstream technologies to developing new memory and computing architectures for Big Data and Artificial Intelligence.