The Applied Materials platforms that create our Integrated Materials Solution for cobalt have been industry workhorses for several decades, and the innovations being developed show they remain critical for the dimensional and materials scaling necessary to continue improving the power, performance and area/cost (PPAC) of chips.
My previous blog explained the computing architecture requirements for AI workloads. Now, I take a deep dive into the types of materials engineering breakthroughs needed to enable these new architectures.
I recently sat down for a video interview with G. Dan Hutcheson, CEO of VLSIresearch, to discuss why the industry is moving to new memory solutions and what strategies are being implemented to alleviate the memory bottleneck.
As the semiconductor industry begins producing logic devices for the single digit nodes, new conductors are being evaluated as replacements for copper to manage resistance scaling. Applied Materials’ Mehul Naik highlights one of the leading contenders.