Leading technology CEOs and industry thought leaders from across the computing ecosystem convened in San Francisco earlier this week at the second AI Design Forum™ to discuss the future of computing—from materials to systems. What was made clear from the thought-provoking keynotes and many sideline discussions is that AI and Big Data create tremendous growth opportunities for the industry, but to realize their potential requires new levels of innovation.
Join Applied Materials at the 2019 SPIE Advanced Lithography Symposium as we present our latest R&D advancements on layer-to-layer alignment, defect detection and 3D pattern characterization, and highlight new e-beam technology.
Applied Materials is a member of the new IBM Research AI Hardware Center—a new ecosystem of research and commercial partners collaborating with IBM to further accelerate the development of AI-optimized hardware innovations.
Applied Materials convened a panel of industry experts to explore trends and challenges for memory technology over the next decade—from continued scaling of mainstream technologies to developing new memory and computing architectures for Big Data and Artificial Intelligence.