Join Applied Materials at the 2019 SPIE Advanced Lithography Symposium as we present our latest R&D advancements on layer-to-layer alignment, defect detection and 3D pattern characterization, and highlight new e-beam technology.
Applied Materials is a member of the new IBM Research AI Hardware Center—a new ecosystem of research and commercial partners collaborating with IBM to further accelerate the development of AI-optimized hardware innovations.
Applied Materials convened a panel of industry experts to explore trends and challenges for memory technology over the next decade—from continued scaling of mainstream technologies to developing new memory and computing architectures for Big Data and Artificial Intelligence.
The ability to detect and identify defects becomes increasingly difficult as chips continue to shrink. In this blog, I discuss a new approach to Defect Review Scanning Electron Microscopy that increases sensitivity of defect identification and isolates true defects from the noise.
I recently sat down for a video interview with G. Dan Hutcheson, CEO of VLSIresearch, to discuss why the industry is moving to new memory solutions and what strategies are being implemented to alleviate the memory bottleneck.
As the semiconductor industry begins producing logic devices for the single digit nodes, new conductors are being evaluated as replacements for copper to manage resistance scaling. Applied Materials’ Mehul Naik highlights one of the leading contenders.