Next-Generation TVs and Mobile Devices

Next-Generation TVs and Mobile Devices

This year is an important and exciting year for the display industry.  The leading display companies including BOE Technology Group, Co. are responding to strong consumer demand for next-generation televisions and mobile devices which require higher performance, longer battery life and thinner form factors.  The leading display makers are also responding to inflection points in their product roadmaps as new materials and technologies such as metal oxide and large area low temperature poly-silicon (LTPS) are required in the manufacturing of faster and smaller thin film transistors.
Applied Materials

Follow Along! The Applied Materials Social Conversation at SEMICON West

SEMICON West is one of the most important events for the semiconductor equipment manufacturing industry and its suppliers. This week, Applied Materials' technologists will lead a series of discussions on advanced transistors, roll-to-roll manufacturing, the transition to 450mm, and strategic investing. Follow along below (and check back regularly!) for a snapshot of the most interesting conversations coming out of Semicon West from Applied Materials and other notable show attendees.
Applied Materials

Asiana Airlines Flight 214

Yesterday we learned that Asiana Airlines flight 214 – inbound from Incheon Airport, Seoul, South Korea – crash-landed at San Francisco International Airport.  First and foremost, our thoughts and prayers are with the passengers, crew and their family members.  Three Applied Materials employees were on the plane and, thankfully, all three are safe, though they did suffer minor injuries and received medical attention.  We know that many of our customers, suppliers and industry colleagues are travelling to San Francisco for this week’s SEMICON West and assume some may have been on board the flight.  Our hope is for the safety of all who have been affected by this incident.  While we are thankful that our colleagues and most passengers are safe, we take a moment to remember those who suffered tremendous loss. 
2013 Applied Materials Analyst Meeting & SEMICON West Activities

2013 Applied Materials Analyst Meeting & SEMICON West Activities

Cutting-edge technology advancements in the semiconductor and display equipment manufacturing industries increasingly are being driven by mobility. The rapid growth in smartphones and tablets has propelled manufacturers to explore new advanced materials, manufacturing processes, and transistor technologies in order to keep up with the accelerating pace of innovation.    Mobility applications demand higher resolution and higher performance in LCD, OLED and touch panel displays.  Enhanced viewing experiences through OLED and flexible displays, combined with thinner, lighter, greener and more portable form factors, are right around the corner. On July 8 beginning at 1:00pm PT at our Santa Clara, Calif. headquarters, Applied Materials will discuss these trends and the company’s role in advancing the semiconductor and display industries during our annual Analyst Meeting.
Survey Says: We Can Do Better—and We Are

Survey Says: We Can Do Better—and We Are

Applied Materials is a place where the voice of the customer comes through loud and clear. Each year we conduct a comprehensive customer satisfaction survey so customers can tell us how we’re doing.  As we prepare for the 2013 survey, we reflect on last year’s results. Last summer we contacted more than 1,400 customers globally and got a response rate of 70 percent. Much of what we heard from respondents made us proud: across the board our customer satisfaction and loyalty ratings have gone up significantly. But there were still some pain points customers asked us to address. In the June 2013 issue of Nanochip Fab Solutions, we highlight what Applied is doing to engineer a better customer experience. This companywide effort encompasses technology, services, training, and process improvements.
Overcoming Shallow Trench Isolation Challenges for Sub-20 Nanometer

Overcoming Shallow Trench Isolation Challenges for Sub-20 Nanometer

To prevent electrical current leaking between adjacent transistors, state-of-the-art microchips feature shallow trench isolation (STI) to isolate transistors from each other. Key steps in the STI process involve etching a pattern of trenches in the silicon, depositing dielectric materials to fill the trenches, and removing the excess dielectric using technologies such as chemical-mechanical planarization (CMP). But as the industry scales to sub-20 nanometers significant challenges for the STI etch step are emerging.