Join Applied Materials at the 2019 SPIE Advanced Lithography Symposium as we present our latest R&D advancements on layer-to-layer alignment, defect detection and 3D pattern characterization, and highlight new e-beam technology.
Applied Materials is a member of the new IBM Research AI Hardware Center—a new ecosystem of research and commercial partners collaborating with IBM to further accelerate the development of AI-optimized hardware innovations.
Applied Materials convened a panel of industry experts to explore trends and challenges for memory technology over the next decade—from continued scaling of mainstream technologies to developing new memory and computing architectures for Big Data and Artificial Intelligence.
My previous blog explained the computing architecture requirements for AI workloads. Now, I take a deep dive into the types of materials engineering breakthroughs needed to enable these new architectures.
This two-part blog series examines the changes needed to computing architectures in the AI era and the role materials engineering will play to make it happen.
The first material change in the transistor contact and interconnect in 20 years is required to remove a major performance bottleneck between transistors and the outside world.
The final installment of my blog series discusses the need for “integrated materials systems” and why the days of working with individual materials from the periodic table are over.
Part 2 of my blog series looks at how new materials, materials engineering and 3D design techniques are extending the semiconductor technology roadmap even as classic 2D scaling reaches physical and economic limits.
CMP continues to be a key technology for materials-enabled scaling for the latest 3D inflections in NAND and logic, and will be critical to managing edge placement error.
