Proliferating mobile, “smart” electronic consumer products, Internet of Things devices, and high-performance computing applications are driving greater complexity in wafer-level packaging schemes and expanding the number of electrochemical deposition steps in their fabrication.
Applied Materials recently hosted top-tier bio-entrepreneurs from San Francisco’s QB3 incubator to explore opportunities for coupling great science with great engineering to create innovations in life science.
Given the inherently complex nature of semiconductor manufacturing, chip makers are increasingly using automated software systems to make fabs more intelligent and responsive, with the ultimate goal of improving productivity and yield.
As we wrap up 2016, it is an ideal time to reflect on the accomplishments of Applied teams around the world who have demonstrated a commitment to the company’s core value of operating with responsibility and integrity.
While the mainstay applications of the MEMS segment continue to be strong performers, 2016 saw a big push toward lots of new and potentially high-volume MEMS devices. This presents many exciting opportunities, but the challenges are plenty.